| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board, which can manufacture a circuit board having a high-density circuit pattern without adding insulators. SOLUTION: A method of manufacturing a printed circuit board comprises: a step (a) of forming a conductive convex pattern, in which a first plating layer, a first metal layer, and a second plating layer are sequentially laid so as to correspond to a first circuit pattern, on a seed layer laid on a carrier; a step (b) of laying an insulator so that it faces the one surface of the carrier on which the conductive convex pattern is formed and of press-bonding the carrier and the insulator to each other; a step (c) of removing the carrier to transfer the conductive convex pattern to the insulator; a step (d) of forming a conductive pattern, in which a third plating layer and a second metal layer are sequentially laid so as to correspond to a second circuit pattern, on the one surface of the insulator that has the transferred conductive convex pattern; a step (e) of removing the first plating layer and the seed layer; and a step (f) of removing the first metal layer and the second metal layer. COPYRIGHT: (C)2008,JPO&INPIT
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