发明名称 Plated vias exit structure for printed circuit board
摘要 A circuit board (600) design is disclosed that is useful in high speed differential signal applications uses a circuit trace exit structure (620) and optionally a via arrangement. The circuit trace exit structure involves the exit portions (620) of the circuit traces (550) of the differential signal vias (609) to follow a path where the traces then meet with and join to the transmission line portions (552,612) of the conductive traces (550). In the via arrangement, sets of differential signal pair vias (551,609) and an associated ground (593a) are arranged adjacent to each other in a repeating pattern. The differential signal vias of each pair (591) are spaced closer to their associated ground via (593a) than the spacing between the adjacent differential signal pair associated ground (593b) so that differential signal vias exhibit a preference for electrically coupling to their associated ground vias.
申请公布号 EP1841298(A3) 申请公布日期 2008.05.07
申请号 EP20070110136 申请日期 2005.02.14
申请人 MOLEX INCORPORATED 发明人 REGNIER, KENT, E.;BRUNKER, DAVID, L.;OGBUOKIRI, MARTIN, U.
分类号 H05K1/11;H01L23/64;H01L23/66;H01R12/16;H01R13/658;H01R24/00;H05K1/02;H05K3/42 主分类号 H05K1/11
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