| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device by suppressing the generation of cracks in a wiring board during a severe reliability test. <P>SOLUTION: The semiconductor device 1 is constituted in such a manner that a semiconductor chip 2 is mounted to a wiring board 3 with an electrode 2a of the semiconductor chip 2 connected to a connection terminal 15 of the wiring board 3 by a bonding wire 4, and a sealing resin 5 is so formed on the top face 3a of the wiring board 3 as to coat the semiconductor chip 2 and the bonding wire 4, and solder balls 6 are connected to the bottom face 3b of the wiring board 3. The wiring board 3 is a resin substrate containing glass cloth. The softening temperature of a resin material of a substrate layer 11 of the wiring board 3 is set higher than the melting point of a solder from which the solder balls 6 which are terminals for external connection are formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
