发明名称 THREE-DIMENSIONAL PRINTED CIRCUIT BOARD FOR USE WITH ELECTRONIC CIRCUITRY
摘要 A method for forming and using a resulting patterned discrete section to interconnect a plurality of printed circuit boards having electrical contact pads. The patterned discrete section is comprised of one or more dielectric sheets having an exposed first surface and an exposed second surface and a plurality of electrically conductive compliant features on each of the two exposed surfaces. The plurality of electrically conductive compliant features are configured to electrically couple to the electrical contact pads on the plurality of printed circuit boards, thereby providing a discrete means to provide electrical coupling between the patterned discrete section and the plurality of printed circuit boards.
申请公布号 US2008099232(A1) 申请公布日期 2008.05.01
申请号 US20070690903 申请日期 2007.03.26
申请人 SILICON TEST SYSTEMS, INC. 发明人 MAYDER ROMI O.
分类号 H05K1/02 主分类号 H05K1/02
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