COPPER CLAD LAMINATE, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF CCL

摘要

A CCL(Copper Clad Laminate), a PCB(Printed Circuit Board), and a CCL manufacturing method are provided to secure high heat resistance and high junction property with copper clad and to increase the dielectric property to the desirable level. A CCL is composed of a prepreg(10) formed by impregnating a low-loss polymer composition with glass fiber and a complex film(20) containing an inorganic filler selected from ceramic and metal materials, carbon black, and graphite and a low-loss polymer composition. The low-loss polymer composition contains thermoplastic resin selected from PPO(Polyphenylene Oxide), copolymer of PPO and PS(Polystyrene), cyclic olefin, and PEI(Polyetherimide) and thermosetting materials applying cross-linking property to the thermoplastic resin. The prepregs are laminated on both ends of a complex film layer formed by laminating the complex films in at least two layers. The copper clad is formed at both ends of the laminated prepreg.