STABILIZED ETCHING SOLUTIONS FOR Cu AND Cu/Ni LAYERS,申请号IL20080188939-传众专利搜索

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发明名称	STABILIZED ETCHING SOLUTIONS FOR Cu AND Cu/Ni LAYERS
摘要
申请公布号	IL188939(D0)	申请公布日期	2008.04.13
申请号	IL20080188939	申请日期	2008.01.22
申请人	BASF SE	发明人
分类号	C23F	主分类号	C23F
代理机构		代理人
主权项
地址

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