| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a conductive pattern with high conductivity which uses an etching liquid with less environmental load, the reduced number of steps and low-temperature processing that is applicable even for a plastic substrate. SOLUTION: The method includes at least a step to apply conductive ink composition containing at least metallic particles with an average particle size of 1 nm or more and 50 nm or less and an aqueous solvent to a substrate; a step to dry the ink composition; a step to form an etching resist pattern on the dried ink composition by printing method; a step to immerse the substrate processed in the above steps in water and to remove he dried ink composition in an area without the etching resist ink; a step to remove the etching resist; and a step to heat the substrate processed in the above steps and to produce conductivity. COPYRIGHT: (C)2008,JPO&INPIT
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