发明名称 |
Circuit board fabrication method and circuit board |
摘要 |
A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.
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申请公布号 |
US7353600(B2) |
申请公布日期 |
2008.04.08 |
申请号 |
US20040940933 |
申请日期 |
2004.09.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUKAHARA NORIHITO;NISHIKAWA KAZUHIRO;SAKURAI DAISUKE |
分类号 |
H05K3/00;H05K3/46;H05K3/12 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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