| 摘要 |
<p>A light emitting diode is provided to prevent a substrate from being damaged caused by the generation of step when a molding part is formed in a transfer mold scheme and the high pressure is applied. A light emitting diode includes a substrate(100), a light emitting chip(120), first and second lead patterns(104) and a molding unit. A through-hole(106) is formed on the substrate. The light emitting chip is adapted on a portion of the substrate. The first and second lead patterns are formed in one side and another side of the substrate with a distance therebetween, to apply external power source to the light emitting chip. The molding unit is employed to envelop the light emitting chip and fill the through-hole. The trough-hole is formed in at least a portion of the first lead pattern or second lead pattern or between the first and second patterns.</p> |
