MANUFACTURING METHOD OF PAPER WITH IC TAG INLET EMBEDDED

摘要

PROBLEM TO BE SOLVED: To provide an application method that can operationally stably apply adhesive as means for improving adhesion of non-contact IC tag inlets and paper layers when the IC tag inlets are embedded between the paper layers in a papermaking process.

SOLUTION: A manufacturing method of paper with IC tag inlets embedded which places non-contact IC tag inlets on a surface of wet paper A formed on a screen a and laminates it with wet paper B formed on another screen sprays adhesive on the surface of the wet paper A before placing the IC tag inlets. The adhesive may further be sprayed on the IC tag inlets after the IC tag inlets are placed on the surface of the wet paper A.

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