发明名称 LIQUID DISCHARGE APPARATUS AND METHOD OF FORMING RESIST PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a liquid discharge apparatus and a method of forming a resist pattern for forming a resist pattern having prescribed thickness by layering a resist solution. SOLUTION: A head 12 for discharging the resist solution on a wiring board 2 has a plurality of nozzles arranged in the main scanning direction and a plurality of nozzles arranged over the length corresponding to the width of the wiring board on in the sub-scanning direction and the resist pattern is formed on the whole surface of the wiring board by scanning the wiring board and the head only once in the main scanning direction. The resist solution 102 discharged from the nozzles in the second row is layered on a landing position of the resist liquid 100 discharged from the nozzles in the first row in the nozzles arranged in the main scanning direction after the resist solution 100 is fixed to the wiring board at a prescribed time interval. Further the resist solution 104... discharged from different nozzles arranged in the main scanning direction are layered at a prescribed time intervals to form the resist pattern having the prescribed thickness. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008073647(A) 申请公布日期 2008.04.03
申请号 JP20060257794 申请日期 2006.09.22
申请人 FUJIFILM CORP 发明人 INOUE SEIICHI
分类号 B05C5/00;B05C11/10;B05D1/26;B05D7/00;H05K3/06 主分类号 B05C5/00
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