| 摘要 |
<p>Method for separating mixtures from cutting suspensions containing semiconductor materials and materials comprises separating the materials to be separated by their different specific weights using a separating liquid. Preferred Features: The separating liquid is made from a solution of either an organic liquid substance or a solution of suitable inorganic or organic salts. The fraction floating on the separating fluid is mechanically removed from the surface of the separating fluid. The sedimented fraction is recovered by pouring off the liquid.</p> |
