| 摘要 |
<p>A bonding layer for resin and a laminate producing method using the same are provided to provide a wiring board of high reliability by increasing adhesion strength with interlayer insulation resin, solder resist, etching resist, conductive resin, conductive paste, conductive adhesive, dielectric resin, hole filling resin, and a flexible coverlay film in forming the bonding layer on the surface of a conductive layer. A bonding layer for resin is made of resin, copper or copper alloy for bonding a copper or copper alloy layer. The bonding layer for resin is a metal layer of the coralloid structure having plural copper or copper alloy particles, voids existing among the particles, and plural fine holes formed on the surface. The mean diameter of the fine hole is within a range of 10-200 nm. Two fine holes are formed per 1 mum^2 on the average.</p> |
