| 摘要 |
A flip chip package is provided to embody an increase of a height caused by an increased volume after a pre-solder is hardened by forming a pre-solder composed of solder particles with different sizes. A substrate(1) has an electrode terminal(2) to which a bump formed in a flip chip is attached. A pre-solder is formed on the surface of the electrode terminal, composed of first and second solder particles(4,5). The first solder particle has a first size, used for reliably attaching the bump formed in the flip chip. The second solder particle has a size not greater than 1/3 of the size of the first solder particle. The first and second solder particles are attached to the electrode terminal of the substrate by using an attach member as a medium. The second solder particle can have a size not greater than 1/3-1/5 of the size of the first solder particle. |
