| 摘要 |
Temporary assembling is carried out by inserting an ion conducting actuator into a groove which is provided at a central portion of a substrate. Thereafter, a bump is pressed by forcing in a direction of a surface of the substrate while carrying out leveling and thrust control, by a flat portion of a pedestal having a recess which is provided such that the ion conducting actuator is not crushed. At this time, due to a deformation of the bump which is pressed, the electrical connections are carried out assuredly, and the ion conducting actuator is held mechanically by both sides.
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