| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a semiconductor device capable of cooling a substrate efficiently and uniformly. <P>SOLUTION: A plurality of recesses 21 corresponding to the formation region of a semiconductor device on a substrate 6 are formed on the surface of a mount table 20, an exhaust port 24 of a first refrigerant for cooling the substrate 6 is opened at the center of a recess 21, and an inlet 25 of the first refrigerant is opened at the periphery of the recess 21. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
