| 摘要 |
A method for manufacturing a semiconductor device, the method includes: moving a nozzle around a semiconductor chip bonded to a wiring substrate by face-down bonding; and continuously supplying underfill material through the nozzle, thereby filling the underfill material between the wiring substrate and the semiconductor chip, wherein an outline of a surface of the semiconductor chip opposing to the wiring substrate is a polygon composed of a plurality of sides, a moving track of the nozzle includes a linear track within a range of a pair of line segments drawn from both ends of each of the sides perpendicularly to said each of the sides, and a direction changing track that continuously connects adjacent ones of the linear tracks, wherein the nozzle is moved slower in at least a portion of the linear track than in the direction changing track.
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