发明名称 ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION
摘要 <p>An adhesive composition containing as the main component a polymer obtained by subjecting a monomer composition comprising styrene, a (meth)acrylic ester having a cyclic structure, and an alkyl (meth)acrylate having a chain structure to copolymerization. The polymer contains a styrene block segment and is therefore improved in heat resistance, bond strength under high-temperature conditions, alkali resistance, and easiness of peeling after high-temperature process. Thus, the invention provides an adhesive composition which exhibits high heat resistance, high bond strength under high-temperature conditions, and high alkali resistance and which is easy to peel after high-temperature process.</p>
申请公布号 WO2008029569(A1) 申请公布日期 2008.03.13
申请号 WO2007JP65060 申请日期 2007.08.01
申请人 TOKYO OHKA KOGYO CO., LTD.;ASAI, TAKAHIRO;MISUMI, KOICHI;MIYANARI, ATSUSHI;INAO, YOSHIHIRO;NAKAMURA, AKIHIKO;SAITO, KOJI 发明人 ASAI, TAKAHIRO;MISUMI, KOICHI;MIYANARI, ATSUSHI;INAO, YOSHIHIRO;NAKAMURA, AKIHIKO;SAITO, KOJI
分类号 C09J153/00;C08F293/00;C08L53/00;C09J7/00 主分类号 C09J153/00
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