| 摘要 |
<p>Hard solder has the general formula FeaNiRestSibBcMd. a =5 - 35 atom%; b = 1 - 15 atom%; c = 5 - 15 atom%; d = 0 - 4 atom%; and Rest indicates the content of nickel and incidental impurities; M is one or more of: cobalt, chromium, manganese, niobium, molybdenum, tantalum, copper, silver, palladium or carbon. The solder has a maximum liquidus temperature of 1025[deg] C. Independent claims are included for: (A) amorphous, ductile hard solder sheets of the same composition; (B) heat exchangers with solder beads produced from the hard solder; (C) heat exchangers with solder beads produced from the hard solder sheets; (D) a bonding method for two components comprising soldering with the hard solder; (E) a bonding method for two components comprising soldering using the hard solder sheets; (F) a method for making the hard solder sheets by heating a melt of the solder and preparing the sheets by cooling the melt at a rate of more than 105>[deg] C/sec; (G) a bonding method for two components comprising preparing hard solder sheets using the method described and soldering the components using the product; (H) hard soldered objects produced using the solder; and (I) hard soldered objects produced using the solder sheets.</p> |
