发明名称 |
Semiconductor device and method of producing the same |
摘要 |
A semiconductor device includes a semiconductor substrate having an internal circuit; an electrode pad electrically connected to the internal circuit; an insulating film having a through hole exposing the electrode pad; and a re-distribution wiring pattern formed on the insulating film and electrically connected to the electrode pad. The semiconductor device further includes a recess groove formed in the insulating film around and adjacent to the re-distribution wiring pattern.
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申请公布号 |
US2008054479(A1) |
申请公布日期 |
2008.03.06 |
申请号 |
US20070889830 |
申请日期 |
2007.08.16 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
WATANABE KIYONORI |
分类号 |
H01L23/48;H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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