| 摘要 |
PROBLEM TO BE SOLVED: To raise strength for supporting both substrates neither increasing a substrate area nor affecting a sensor, concerning a sensor device which is obtained by joining the two substrates joined via bumps with a sensor facing inward to a package via bumps. SOLUTION: One surface of a circuit substrate 20 is made to face one surface of a sensor substrate 10 having a mobile part 11 as the sensor on one surface, and joined via the first bumps 31. Besides, both the substrates 10, 20 are joined/supported in the package 40 via the second bumps 32 in the peripheries of one surface of the circuit substrate 20, concerning an acceleration sensor device S1. The other surface at the opposite side of one surface on the mobile part 11 side in the sensor substrate 10, and also the other surface at the opposite side of one surface on the side of the second bumps 32 in the circuit substrate 20, are made to adhere and to be supported in the package 40 via an adhesive 50 as a support member. COPYRIGHT: (C)2008,JPO&INPIT
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