METHOD OF GROWING SILICON SINGLE CRYSTAL AND PROCESS FOR PRODUCING SILICON WAFER

摘要

In a method for growing a silicon single crystal, a silicon single crystal is grown by the Czochralski method to have an oxygen concentration of 12×10 17 to 18×10 17 atoms/cm 3 on ASTM-F 121 1979. A mixed gas of an inert gas and a gaseous substance containing hydrogen atoms is used as an atmospheric gas for growing the single crystal. A temperature of the silicon single crystal is controlled during the growth of the crystal such that the ratio Gc/Ge of an axial thermal gradient Gc at the central portion of the crystal between its melting point and its temperature of 1350°C to an axial thermal gradient Ge at the periphery of the crystal between its melting point and its temperature of 1350°C is 1.1 to 1.4. The axial thermal gradient Gc at the central portion of the crystal is 3.0 to 3.5°C/mm.