发明名称 |
Physical quantity sensor having multiple through holes |
摘要 |
A semiconductor physical quantity sensor includes: a substrate; a semiconductor layer supported on the substrate; a trench disposed in the semiconductor layer; and a movable portion disposed in the semiconductor layer and separated from the substrate by the trench. The movable portion includes a plurality of through-holes, each of which penetrates the semiconductor layer in a thickness direction. The movable portion is capable of displacing on the basis of a physical quantity applied to the movable portion so that the physical quantity is detected by a displacement of the movable portion. The movable portion has a junction disposed among the through-holes. The junction has a trifurcate shape.
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申请公布号 |
US7337670(B2) |
申请公布日期 |
2008.03.04 |
申请号 |
US20070649254 |
申请日期 |
2007.01.04 |
申请人 |
DENSO CORPORATION |
发明人 |
MURATA MINORU;YOKOYAMA KENICHI;ASAI MAKOTO |
分类号 |
G01P15/00;B81B3/00;G01C19/56;G01P15/125 |
主分类号 |
G01P15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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