发明名称 Physical quantity sensor having multiple through holes
摘要 A semiconductor physical quantity sensor includes: a substrate; a semiconductor layer supported on the substrate; a trench disposed in the semiconductor layer; and a movable portion disposed in the semiconductor layer and separated from the substrate by the trench. The movable portion includes a plurality of through-holes, each of which penetrates the semiconductor layer in a thickness direction. The movable portion is capable of displacing on the basis of a physical quantity applied to the movable portion so that the physical quantity is detected by a displacement of the movable portion. The movable portion has a junction disposed among the through-holes. The junction has a trifurcate shape.
申请公布号 US7337670(B2) 申请公布日期 2008.03.04
申请号 US20070649254 申请日期 2007.01.04
申请人 DENSO CORPORATION 发明人 MURATA MINORU;YOKOYAMA KENICHI;ASAI MAKOTO
分类号 G01P15/00;B81B3/00;G01C19/56;G01P15/125 主分类号 G01P15/00
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