A POSITION CHANGING DEVICE AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A position changing device and a system for manufacturing a semiconductor package are provided to simplify a manufacturing process of an upper side and a lower side of the semiconductor package to reduce defects by automatically rotating a zig on which the semiconductor package is loaded. A jig fixing unit(530) fixes a jig into which a package is inserted. A rotational unit(540) rotates the jig fixing unit. A moving unit(550) moves the jig fixing unit to the outside of a position changing device. A cleaning unit is formed on a side of the jig fixing unit to clean the package of the jig fixed on the jig fixing unit. The jig fixing unit includes a fixing unit(534) fixing the jig. A frame(532) is formed in the jig fixing unit. A jig receiving space(531) on which the jig is fixed is prepared on the frame. The fixing unit includes a fixing member(537) and a moving member(538). The fixing member fixes both ends of the jig and moves along the frame. The moving member is formed on a side of the frame to move the fixing member.