| 摘要 |
A semiconductor inspecting apparatus is provided to precisely sort a normal semiconductor chip from an abnormal semiconductor chip on a wafer by transferring an electrical signal outputted from main test equipment to a probe card through a test head. A test head outputs an electrical signal transferred from main test equipment through a plurality of pogo pins installed in the lower surface of the test head. A plurality of needles are installed on one surface of a printed circuit board(72) in a probe card, electrically connected to a wafer. The test head is electrically connected to the probe card by a connection unit. The connection unit includes a first substrate, a second substrate(40), a first terminal(50) and a second terminal(60). A plurality of terminals connected to the pogo pin are installed in the first substrate. The second substrate is electrically connected to the first substrate. The first terminal is installed on one surface of the second substrate, having an insert groove at its one side wherein an electrical signal outputted through the pogo pin is applied to the first terminal. The second terminal is installed on the printed circuit board opposite to the needle of the probe card, including an elastic member(64) and inserted/separated into/from the insert groove. The cross section area of the center part of the second terminal is greater than that of the insert groove. The cross section of the insert groove and the cross section of the second terminal can be circular shapes, respectively.
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