| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a manufacturing method of an inexpensive semiconductor light-emitting device having a high light extracting efficiency and capable of achieving high luminance and high definition. <P>SOLUTION: This manufacturing method of a semiconductor light-emitting device 1 includes a step of covering a semiconductor light-emitting element 20 disposed on a substrate 10 with a phosphor-including material portion 40, a step of filling a light-transmissive sealing material 51 to a concave portion 35 of a light-transmissive sealing material molding die 30 having the lens-shaped concave portion 35, a step of applying an air pressure to the sealing material 51, a step of disposing the substrate 10 on the molding die 30 so that the semiconductor light-emitting element 20 covered with the phosphor-containing material 40 can be inserted into the concave portion 35 of the molding die 30, and a step of curing the sealing material 51 to remove the substrate 10 from the molding die 30 and a lens-shaped light-transmissive sealing body 50. <P>COPYRIGHT: (C)2008,JPO&INPIT |
