GLAESERSPUELAPPARAT AUS GUMMISCHLAUFEN.,申请号DE195600K2697U-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	GLAESERSPUELAPPARAT AUS GUMMISCHLAUFEN.
摘要
申请公布号	DE1736001(U)	申请公布日期	1956.12.13
申请号	DE195600K2697U	申请日期	1956.05.29
申请人	FRIEDRICH KRESSMANN	发明人	FRIEDRICH KRESSMANN
分类号		主分类号
代理机构		代理人
主权项
地址

您可能感兴趣的专利

DC-DC Converter for Vehicle

STADIUM MEMORABILIA SUPPORT BASE

EJECTION SEAT PAN LIFTER

RECLINING AND OTTOMAN-EXTENDING CHAIR MECHANISM

MULTILAYER LOAD BEARING PANEL

Shopping Cart Basket and Method of Manufacture

Adhesive backed Finger Holds and Purlicue Stop for fitment to Handheld Devices

SYSTEM AND METHOD OF MODIFYING THE FRICTION OF RAILROAD TRACKS

CONVERTIBLE TANDEM AXLE ARRANGEMENT AND METHOD FOR CONVERTING A TANDEM AXLE ARRANGEMENT TO EITHER OF A SINGLE DRIVE OR A DUAL DRIVE TANDEM AXLE ARRANGEMENT

REPAIR OF REFILLABLE OR REUSABLE POLYMER-BASED PACKAGING

APPARATUS AND METHOD FOR FORMING THREE-DIMENSIONAL PATTERN USING ELECTROJETTING

METHOD FOR MANUFACTURING LAMINATED ROTOR CORE

Method for 3-D Printing a Custom Bone Graft

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR AND ELECTRONIC SUB-SYSTEM PACKAGING

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

Semiconductor Constructions

Semiconductor Constructions and Methods of Forming Electrically Conductive Contacts

SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD THEREOF

Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF