BONDING ARCHITECTURE FOR 3D MODULE

摘要

A bonding structure of a 3D module is provided to bond the barrier panel to the front of an image panel for displaying an image, thereby displaying a 3D image effectively. A first FPC(Flexible Printed Circuit film)(12) and a driving IC(14) for driving the FPC are formed in a first end portion of an image panel(10). A barrier panel(20) is bonded to the front of the image panel. A second FPC(22) is formed in a first end portion of the barrier panel. A backlight unit(30) is bonded to the rear of the image panel to supply light to the image panel. The image panel and the barrier panel are bonded to each other by an adhesive. The first end portion of the image panel and the first end portion of the barrier panel are disposed in the same direction so that the first FPC and the second FPC are arranged in the same direction.