| 摘要 |
A circuit board with vias that are suitable for use as test pads can be made according to a method whereby a first end of a via is blocked prior to heating solder paste that covers the opposite end of the via. As a result, air is trapped in the via when the solder paste is heated, which prevents melted solder paste from flowing in. Instead, the solder paste forms a dome shaped test pad over the via, which facilitates contact with the test probe. When applied to OSP circuit boards, the result is an OSP board with at least via that has a blocking material at one end and a solder dome over the opposite end. |
