| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for dicing, generating little die fly at a wafer edge in dicing, generating little chipping, free from adhesion of hair-like substrate and having excellent pick-up performance after the dicing process. SOLUTION: The adhesive tape for dicing has an adhesive layer laminated on a substrate film (resin layer). The adhesive constituting the adhesive layer is produced from a copolymer containing a constitution unit derived from an alkyl (meth)acrylate monomer having a≥2C alkyl group and a constitution unit derived from 2-hydroxypropyl acrylate and/or 2-hydroxybutyl acrylate and containing 5-99.5 mass% alkyl (meth)acrylate monomer by crosslinking the copolymer with an isocyanate compound. COPYRIGHT: (C)2008,JPO&INPIT |
