| 摘要 |
<p>Method for cutting and collecting a dissection comprises applying a sample to a carrier of a laser-dissection microscope, lowering a collecting adhering device onto the sample and cutting one or dissections from the sample. An independent claim is also included for a laser dissection microscope for cutting and collecting a dissection. Preferred Features: The collecting adhering device lies on the sample in the lowered state. The collecting adhering device lies on the sample in the lowered state.</p> |
