| 摘要 |
A printed wiring board capable of being highly densedly received in a housing of an electronic apparatus. A printed wiring board (40) of a preferred embodiment of the invention has a base material (1), a conductor (7) formed in a region (36) to be bent, and conductors (8, 9) formed in a region (46) not to be bent. The conductor (7) formed in the bent region (36) has an overall thickness of 1 to 30 mum, and the conductors (8, 9) formed in the non-bent region (46) has an overall thickness of 30 to 150mum.
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