| 摘要 |
A method for detecting a height of a clean sheet and a wafer prober are provided to protect a probe of a probe card while improving a cleaning effect for the clean sheet. Images of a clean sheet(208) with uneven bending on a surface thereof are taken by an image pickup device(212). An image for n predetermined regions in the images taken by the image pickup device is extracted. Focused portions in the images are detected to measure height values on each position. The maximum value or minimum value among the height values is set as a reference value of a surface height of the clean sheet. An opposite position between the clean sheet and the image pickup device is varied for each image pickup.
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