| 摘要 |
A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one contact/mounting element made of semiconductor material and/or metal and/or insulator material to the solder material, heating of at least one part of the semiconductor component to a temperature lying above the melting point of the solder material by impressing an electrical power into the semiconductor component, as a result of which corresponding soldering connections arise between the semiconductor component and the at least one contact/mounting element, and cooling of the connection complex that comprises the semiconductor component and at least one contact/mounting element and was produced in the preceding step.
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