| 摘要 |
<p>A method of perforating a coverlay film, characterized by including the first perforating step of making multiple first product holes (H<SUB>1</SUB>) and two reference holes (H<SUB>4</SUB>) in coverlay film (W) by means of first perforating metal die (510) and the second perforating step of making multiple second through-holes (H<SUB>3</SUB>) in the coverlay film (W) by means of second perforating metal die (540), wherein in the second perforating step, the two reference holes (H<SUB>4</SUB>) are photographed to thereby measure the positions of the reference holes (H<SUB>4</SUB>) in the coverlay film (W), subsequently the position and/or posture of the coverlay film (W) against the second perforating metal die (540) is regulated on the basis of measuring results, and thereafter second product holes (H<SUB>3</SUB>) are formed in the coverlay film (W). Accordingly, this coverlay film perforating method realizes forming of the product holes (H<SUB>3</SUB>) made in the second perforating step to the product holes (H<SUB>1</SUB>) made in the first perforating step with precision corresponding to miniaturization and as a result, forming of a product hole pattern finer than in the prior art.</p> |
