发明名称 HEAT-DISSIPATING ASSEMBLY OF COMPUTER HOUSING
摘要 A heat-dissipating assembly of a computer housing with airways includes a casing. The casing is provided with a first partition and a second partition thereon. The first partition has a recessed space. The first partition is provided thereon with a plurality of penetrating troughs. The second partition is provided with a plurality of air-introducing ports thereon. The positions of the air-introducing ports and the positions of the penetrating troughs of the first partition are staggered respectively. Finally, the back and top of the casing are provided at least one fan respectively. Via this arrangement, after the external air enters the recessed space through the plurality of air-introducing ports, the external air is drawn into the casing by the fan on the first partition to perform an air-cooling effect and the heat dissipation. Finally, the air is drawn out of the casing by the fans provided on the top and back of the casing. Therefore, not only a good heat-dissipating effect can be achieved, but also the noise is reduced.
申请公布号 US2008019092(A1) 申请公布日期 2008.01.24
申请号 US20070768281 申请日期 2007.06.26
申请人 CHEN CHIA-SHENG;LAIO CHIH-PENG 发明人 CHEN CHIA-SHENG;LAIO CHIH-PENG
分类号 H05K7/20 主分类号 H05K7/20
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