发明名称 Heater For Heating a Wafer and Method For Fabricating The Same
摘要 The invention is to provide a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. In order to solve the above object, the invention provides a heater which comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.
申请公布号 US2008017632(A1) 申请公布日期 2008.01.24
申请号 US20070852162 申请日期 2007.09.07
申请人 KYOCERA CORPORATION 发明人 MAKI SEIICHIROU;TAKENOUCHI HIROSHI;MASUYAMA HIROYUKI;NAKAMURA TSUNEHIKO
分类号 H05B3/16;H05B3/68 主分类号 H05B3/16
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