| 摘要 |
PROBLEM TO BE SOLVED: To effectively move a semiconductor package from a tray to a tube, to facilitate the operation, to reduce the price, to reduce the volume, and to facilitate the conveyance. SOLUTION: A tray clip mechanism module includes a slide path substrate, a tray clip, and a tube mechanism. A plurality of slide paths are installed in the surface of the slide path substrate, and one tube can be inserted into each tube insertion tank of a placement recessed tank to be installed in the lower surface of the tray clip and installed in the slide path outlet of the slide path substrate. When the tray clip mechanism module is movably connected to a biaxial rotating mechanism module, and the tray clip mechanism module at a horizontal position grips a tray mounting several semiconductor packages, it is rotated 180°by the second rotation shaft of the biaxial rotating mechanism module, and semiconductor packages of each string on the tray go into each slide path of the slide path substrate. The tray clip mechanism module is tilted to a set angle by a first rotation shaft of the biaxial rotating mechanism module, and hence the semiconductor packages on each slide path slide into the tube of the tube mechanism along the slide path. COPYRIGHT: (C)2008,JPO&INPIT
|
