发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 A light emitting diode package is provided to control a driving operation of a light emitting diode by forming a driving chip and the light emitting diode with a single package to form an efficient conducting structure and an electrode structure. An electrostatic discharge protection element is mounted on a first lead frame part(120). An LED(160) is mounted on a second lead frame part(132). A driving chip(170) is mounted on a third lead frame part(134). A housing part(110) is formed to expose an end of the lead fame part to the outside and to fix the electrostatic discharge protection element and the driving chip. A lens part is formed on an LED mounting region. The driving chip is connected to an external resistor or receives a coding program to supply constant current having a predetermined value.
申请公布号 KR20080006857(A) 申请公布日期 2008.01.17
申请号 KR20060066136 申请日期 2006.07.14
申请人 LG INNOTEK CO., LTD. 发明人 SON, WON JIN
分类号 H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/54
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