DISSIPATIVE CERAMIC WIRE CLAMP

摘要

The present invention relates to a device comprising of dissipative ceramic wire bond clamp for clamping fingers of lead frame at wire bonding machines for electrical connection to integrated circuit component and packages. The advantage of using the dissipative wire bond clamp includes dissipating charge while bonding to avoid damaging delicate electronic devices with high transient current reduction. Further advantage of using the ceramic wire bond clamp includes increasing resistance while bonding so that it conducts electricity at a rate sufficient to prevent charge buildup, but not sufficient to overload the device being bonded.