发明名称 HOLOGRAM TRANSFER FOIL AND MOLDED PRODUCT WITH HOLOGRAM USING THE FOIL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a hologram transfer foil improved in heat resistance causing no thermal whitening and the followability to expansion and contraction even if a degree of expansion is large and capable of transferring a hologram, which is reduced in the lowering of a hologram effect such as cracking or whitening and superior in design properties, to a three-dimensional surface, and a molded product with the hologram using it. <P>SOLUTION: The hologram transfer foil 10 is provided with a base material 11, a mold release layer 13, a hologram layer 15, a reflecting layer 17 and an adhesive layer 19. The mold release layer 13 comprises a melamine resin and the hologram layer 15 contains a cured material of an ionizing radiation curable resin and reactive silicone and polyethylene wax. The ratio of the ionizing radiation curable resin and polyethylene wax of the hologram layer 15 is 100:0.01-10 and the elongation at break of the hologram layer 15 at 23°C after ionizing radiation curing is 5% or above. The hologram layer 15 has heat resistance not causing whitening even if it is allowed to stand for 1 hr in an atmosphere of 150°C in the state of the hologram transfer foil 10. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008006710(A) 申请公布日期 2008.01.17
申请号 JP20060179571 申请日期 2006.06.29
申请人 DAINIPPON PRINTING CO LTD 发明人 TAJIMA SHINJI
分类号 B32B33/00;B29C45/14;B32B27/16;B44C1/17;B65D1/40 主分类号 B32B33/00
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