发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology to achieve both a high capacity density and a high capacity accuracy, to prevent a decline in withstand voltage, and to reduce an increase in leakage current in MIM capacitor which uses a high dielectric constant insulation film such as a hafnium oxide film. SOLUTION: The MIM capacitor comprises a first metal interconnection 700, a processed capacitive film 405, a processed top electrode 215, and a third metal interconnection 702. After an interlayer insulation film formed of silicon oxide is so formed as to cover the first metal interconnection, a first opening is formed in a region of the interlayer insulation film corresponding to a connection hole layer immediately above the first metal interconnection so as not to expose the top face of the first metal interconnection. Then, after a second opening is formed inside the first opening as to expose the surface of the first metal interconnection, the capacitive film and the third metal interconnection are formed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008010609(A) 申请公布日期 2008.01.17
申请号 JP20060179027 申请日期 2006.06.29
申请人 HITACHI LTD 发明人 TAKEDA KENICHI;FUJIWARA TAKESHI;IMAI TOSHINORI
分类号 H01L21/822;H01L21/768;H01L27/04 主分类号 H01L21/822
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