| 摘要 |
A PCB(Printed Circuit Board) for a camera module, and an apparatus and a method for bonding the PCB are provided to check misalignment of PCBs when the PCBs are bonded, and align the PCBs regardless of their shape. PCBs(101,102) include testing terminals(101,102) on both sides of a bonded surface, respectively. A mounting plate(100), on which the PCBs(101,102) are stacked, includes testing terminals(100a) formed on both side portions of an upper surface thereof. A pressing plate(110) presses an upper surface of the PCBs(101,102) stacked on the mounting plate(100) and includes a pair of test pins formed at both side portions of a lower surface thereof. An electric circuit unit(120) is connected to the test pins to form an electrical closed circuit when a testing terminal contacts with end portions of the test pins, and includes a signal short-circuit relay(121) connected to one end thereof. A switch(130) interworks with the relay(121) of the electric circuit unit(120), and applies a drive signal to the pressing plate(100) according to an operation of the relay(121).
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