| 摘要 |
A strip picker device of a semiconductor package is provided to prevent a bottle-neck phenomenon of the semiconductor package by rotating a semiconductor substrate before the semiconductor substrate is transferred to a cutting portion. A strip picker device of a semiconductor package is arranged in a sawing sorter system, which cuts and sorts semiconductor substrates, on which plural semiconductor packages are molded. The strip picker device includes a main body(200) and a pickup member(300). The main body includes a first driving portion(210), driven by a cylinder, and a second driving portion(220), driven by a motor. The pickup member is arranged under the main body and picks up the semiconductor package. The pickup member is rotated according to an operation of the first driving portion. The pickup member is elevated according to an operation of the second driving portion.
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