| 发明名称 |
PER DIE TEMPERATURE PROGRAMMING FOR THERMALLY EFFICIENT INTEGRATED CIRCUIT (IC) OPERATION |
| 摘要 |
<p>Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve perfomrance. Other embodiments are also described.</p> |
| 申请公布号 |
WO2008003018(A1) |
申请公布日期 |
2008.01.03 |
| 申请号 |
WO2007US72315 |
申请日期 |
2007.06.28 |
| 申请人 |
INTEL CORPORATION;RAHAL-ARABI, TAWFIK;MUHTAROGLU, ALI |
发明人 |
RAHAL-ARABI, TAWFIK;MUHTAROGLU, ALI |
| 分类号 |
G06F9/06;G06F1/08;G06F1/32 |
主分类号 |
G06F9/06 |
| 代理机构 |
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