Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

摘要

A method of providing solder bumps on electrode pads of a microelectronic substrate. The method includes: disposing starter solder portions onto respective ones of the electrode pads; performing a starter reflow comprising reflowing the starter solder portions to form starter solder bumps on respective ones of the electrode pads; disposing respective filler solder portions onto respective ones of the starter solder bumps; and performing a filler reflow comprising reflowing the filler solder portions on respective ones of the starter solder bumps to yield respective final solder bumps on the electrode pads.