发明名称 THERMALLY CURABLE RESIN COMPOSITION WITH EXTENDED STORAGE STABILITY
摘要 <p>This invention provides a thermally curable resin copolymer (A), composed mainly of an ethylenically unsaturated monomer (a-1), which produces an acid via decomposition at 150° C. or more, an ethylenically unsaturated monomer (a-2) containing an epoxy group copolymerizable with the ethylenically unsaturated monomer (a-1), and an ethylenically unsaturated monomer (a-3) having a reactive silyl group; a thermally curable resin composition including the thermally curable resin copolymer; a cured film formed from the composition; and a liquid crystal display including the cured film. The thermally curable resin composition has extended storage stability and can be formed into the cured film having good adhesion to a substrate.</p>
申请公布号 KR100789590(B1) 申请公布日期 2007.12.28
申请号 KR20060005983 申请日期 2006.01.19
申请人 发明人
分类号 C08F220/06;C08F220/00;C08L33/04;G02F1/13 主分类号 C08F220/06
代理机构 代理人
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