| 摘要 |
FIELD: structural members of semiconductor devices handling heavy load current and designed for mounting and operating semiconductor chips in electric circuits of power supply, control, communication, and other modules operating under extreme conditions. ^ SUBSTANCE: proposed package for semiconductor device designed to handle heavy load currents has electricity conductive substrate characterized in high heat conductivity whose surface carrying semiconductor chip also mounts output coil with leads disposed in parallel with semiconductor chip base; opposite side of output coil mounts ceramic shell provided with a number of through holes; substrate surface opposing semiconductor chip base is open; substrate is connected to output coil and the latter, to ceramic shell by brazing; through holes are disposed in ceramic shell perpendicular to locating surface of semiconductor chip, size of at least one of these holes being greater than dimensions of semiconductor chip; other holes of ceramic shell communicate with surface connecting the latter with output coil whose respective leads carry binding posts disposed in through holes; in addition, ceramic shell surface opposing that of output coil has recesses whose boundaries pass onto outer edges of through holes or further, their depth exceeding thickness of semiconductor chip flexible leads; tightly mounted on ceramic shell is ring made of high thermal conductivity material to ensure tight joint with cover upon semiconductor chip installation. ^ EFFECT: facilitated manufacture, enhanced heat-transfer capability and operating reliability in electric circuits of power modules. ^ 6 cl, 7 dwg |
