| 摘要 |
The present invention relates to an improved structure of producing white light for LED, and the structure is a light emitting element composed of two chips of different color lights. The two chips are bonded with each other in series. In an epitaxial formation and manufacturing process, a first metal contact end is formed on the backside of the chip in the front and a second metal contact end is formed on the front side of the chip at the back, and the interfaces of the first and second contact ends are bonded by an eutectic solder, so that the two chips are electrically and mechanically coupled with each other. The invention simply uses a current to drive two chips to produce white light, and thus effectively saving the space of a printed circuit board, and enhancing the performance of the LED semiconductor manufacturing process.
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