| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier tool that suppresses contamination in a semiconductor wafer caused by the occurrence of cut refuse from a formed frame when removing an excess section of a dicing tape by using an edge tool, and reduces a possibility that the cut refuse adheres to a mark cut by the edge tool. SOLUTION: The carrier tool has a hollow frame 1 for storing the semiconductor wafer thinned by backgrinding, and a dicing tape 10 that is bonded onto a backside 4 of the frame 1 and adheres and holds the semiconductor wafer. Injection molding is performed to the frame 1 by a molding material including resin. The outer-periphery section of the backside 4 of the frame 1 is cut out for forming a step section 20 for avoiding a cutter edge flatly. When an unneeded excess section 11 of the dicing tape 10 forced out of the frame 1 is cut by a cutter edge 31, the cutter edge 31 does not come into contact with the recessed step section 20, thus preventing the occurrence of a foreign matter without cutting the backside 4 of the frame 1 by the cutter edge 31. COPYRIGHT: (C)2008,JPO&INPIT |
